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dc.contributor.authorKuecuekoglu, E.
dc.contributor.authorIyim, T. B.
dc.contributor.authorAcar, Işıl
dc.contributor.authorOezguemues, Saadet Kevser
dc.date.accessioned2021-03-04T09:47:34Z
dc.date.available2021-03-04T09:47:34Z
dc.date.issued2007
dc.identifier.citationOezguemues S. K. , Iyim T. B. , Acar I., Kuecuekoglu E., "Synthesis of novel silicone modified acrylic resins and their film properties", POLYMERS FOR ADVANCED TECHNOLOGIES, cilt.18, sa.3, ss.213-219, 2007
dc.identifier.issn1042-7147
dc.identifier.othervv_1032021
dc.identifier.otherav_69ebb29d-f387-4ff6-a790-d3805cfe9ce5
dc.identifier.urihttp://hdl.handle.net/20.500.12627/73358
dc.identifier.urihttps://doi.org/10.1002/pat.857
dc.description.abstractNew silicone modified acrylic resins were synthesized and some of their film properties were investigated. At first, macromer (MC) was synthesized by the condensation reaction of the reactive polysiloxane intermediate (Z-6018) and 2-hydroxyethyl methacrylate (HEMA) in toluene as solvent at 110 degrees C under nitrogen atmosphere. Then, MC was reacted with 2-dimethylaminoethyl methacrylate (DMAEMA) at different mole ratios (1:1, 1:3, 1:5) by using benzoyl peroxide as initiator in toluene to obtain novel silicone acrylic resins. These resins were characterized by Fourier Transform Infrared Spectrometry (FT-IR), and their thermal properties were investigated using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) techniques. The properties of the films prepared from these resins were determined. The results showed that these resins are thermally stable polymers and all films are flexible, semi-gloss and have excellent drying, adhesion properties. Copyright (C) 2007 John Wiley & Sons, Ltd.
dc.language.isoeng
dc.subjectKimya
dc.subjectTemel Bilimler (SCI)
dc.subjectFizikokimya
dc.subjectPolimer Karakterizasyonu
dc.subjectTemel Bilimler
dc.subjectPOLİMER BİLİMİ
dc.titleSynthesis of novel silicone modified acrylic resins and their film properties
dc.typeMakale
dc.relation.journalPOLYMERS FOR ADVANCED TECHNOLOGIES
dc.contributor.department, ,
dc.identifier.volume18
dc.identifier.issue3
dc.identifier.startpage213
dc.identifier.endpage219
dc.contributor.firstauthorID10150


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