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dc.contributor.authorAhn, Kiyong
dc.contributor.authorBallikaya, Sedat
dc.contributor.authorAhn, Jae-Pyung
dc.contributor.authorUher, Ctirad
dc.contributor.authorKaviany, Massoud
dc.contributor.authorKim, Hyoungchul
dc.contributor.authorChi, Hang
dc.date.accessioned2021-03-03T16:52:30Z
dc.date.available2021-03-03T16:52:30Z
dc.identifier.citationKim H., Ballikaya S., Chi H., Ahn J., Ahn K., Uher C., Kaviany M., "Ultralow thermal conductivity of beta-Cu2Se by atomic fluidity and structure distortion", ACTA MATERIALIA, cilt.86, ss.247-253, 2015
dc.identifier.issn1359-6454
dc.identifier.othervv_1032021
dc.identifier.otherav_46b3ff2b-a964-41fd-83aa-86fb95af3476
dc.identifier.urihttp://hdl.handle.net/20.500.12627/51112
dc.identifier.urihttps://doi.org/10.1016/j.actamat.2014.12.008
dc.description.abstractWe demonstrate a prototype thermal evolution path for liquid thermal conductivity in solids. Thermal evolution of beta-Cu2Se shows large interstitial displacement of constituent atoms marked by glass-like transitions and an asymptotic liquid thermal transport. Using ab initio molecular dynamics (AIMD), we identify these transitions, and confirm them with in situ transmission electron microscopy and electron energy loss spectroscopy. The thermal disorder of the Cu+ ions forms homopolar Cu-Cu bonds under a rigid Se framework, and at yet higher temperatures the Se framework undergoes thermal distortion. The non-equilibrium AIMD prediction of lattice thermal conductivity shows significant suppression of the phonon transport, in agreement with experiments and molecular behavior. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
dc.language.isoeng
dc.subjectMühendislik ve Teknoloji
dc.subjectMetalurji ve Malzeme Mühendisliği
dc.subjectMETALURJİ VE METALURJİ MÜHENDİSLİĞİ
dc.subjectMühendislik, Bilişim ve Teknoloji (ENG)
dc.subjectMalzeme Bilimi
dc.subjectMALZEME BİLİMİ, MULTIDISCIPLINARY
dc.titleUltralow thermal conductivity of beta-Cu2Se by atomic fluidity and structure distortion
dc.typeMakale
dc.relation.journalACTA MATERIALIA
dc.contributor.departmentUniversity of Michigan System , ,
dc.identifier.volume86
dc.identifier.startpage247
dc.identifier.endpage253
dc.contributor.firstauthorID221372


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