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dc.contributor.authorFranciosi, A
dc.contributor.authorYildirim, Saffettin
dc.contributor.authorLazzarino, M
dc.contributor.authorChiola, D
dc.contributor.authorBeltram, F
dc.contributor.authorSorba, L
dc.date.accessioned2021-03-06T08:13:22Z
dc.date.available2021-03-06T08:13:22Z
dc.date.issued1996
dc.identifier.citationSorba L., Yildirim S., Lazzarino M., Franciosi A., Chiola D., Beltram F., "Thermal stability of engineered Schottky barriers in Al/Si/GaAs(001) diodes", APPLIED PHYSICS LETTERS, cilt.69, ss.1927-1929, 1996
dc.identifier.issn0003-6951
dc.identifier.otherav_dfcf29eb-8e5d-4412-9c7a-24bffd3683c6
dc.identifier.othervv_1032021
dc.identifier.urihttp://hdl.handle.net/20.500.12627/147449
dc.identifier.urihttps://doi.org/10.1063/1.117624
dc.description.abstractSchottky barriers as high (low) as 1.0-1.1 eV (0.2-0.3 eV) obtained in Al/n-GaAs(001) diodes by fabricating Si bilayers at the interface under an excess cation (anion) flux were subjected to sequential annealing cycles in the 100-450 degrees C temperature range. X-ray photoemission and current-voltage studies indicate a higher stability for high-barrier diodes, which retain 90% of the Si-induced interface dipole after a 450 degrees C anneal, as compared to only 32% for the low-barrier devices. Qualitatively different microscopic degradation mechanisms were identified in the two cases. (C) 1996 American Institute of Physics.
dc.language.isoeng
dc.subjectTemel Bilimler (SCI)
dc.subjectFİZİK, UYGULAMALI
dc.subjectFizik
dc.subjectTemel Bilimler
dc.titleThermal stability of engineered Schottky barriers in Al/Si/GaAs(001) diodes
dc.typeMakale
dc.relation.journalAPPLIED PHYSICS LETTERS
dc.contributor.department, ,
dc.identifier.volume69
dc.identifier.issue13
dc.identifier.startpage1927
dc.identifier.endpage1929
dc.contributor.firstauthorID2182158


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